Position Detail

Responsibilities:

• Resolve yield, quality and reliability issues in the qualification of new devices
• Perform pre-tapeout risk assessment and communication with Business line/ Fab on the necessary actions to eliminate/ minimize risk
• Conduct product yield analysis to identify root causes of wafer sort and final test failures
• Work with Customers and Account Managers to maximize die output
• Establish product low yield criteria and dispositioning
• Provide product engineering support to failure analysis lab for electrical fault isolation
• Provide product engineering support to reliability lab to understand and resolve reliability failures
• Compliance to safety, discipline and housekeeping rules
• Support cost reduction through yield improvement and resolving excursion
• Participate in continuous yield and productivity improvement projects
• Provide guidance to junior engineers in daily duties

Requirements:

• Bachelor's Degree in Engineering (Electrical/Electronic) or equivalent
• 2 years of relevant product engineering experiences in front-end wafer fab environment or
• Candidates without experience are welcome to apply
• In depth knowledge of semiconductor device physics, electrical & electronics engineering fundamentals & wafer fabrication processes
• Strong analytical and problem solving skills
• Good communication and interpersonal skills