|
Responsibilities:
- Resolve yield, quality and reliability issues in the qualification of new devices
- Understand new products to improve product yield analysis to identify root cause of wafer sort and final test failures
- Work with customer, Account Manager to maximize die output
- Support cost reduction through yield improvement
- Support fab in resolving excursion
- Diagnose product failure modes and correlate them to sort summary
- Establish product low yield criteria and dispositioning
- To identify WAT parameters, inline parameters that correlate to sort yield
- Provide product engineering support to failure analysis lab for electrical fault isolation
- Provide product engineering support to reliability lab to understand and resolve reliability failures
- Provide technical expertise to AM and test house to help customers run product-level evaluations
- Lead cross functional team in improving product yield and excursion control
- Explore new technique in improving product isolation capability
- Embark on productivity improvement projects
Requirements:
- Masters/ Bachelor's Degree in Engineering Electronics/ Microelectronics/ Electrical or equivalent
- 6-8 years of relevant product engineering or process integration experiences in front-end wafer fab environment
- Good understanding of wafer-fab processes and IC-testing
- Good understanding of Electronic product/ IC design
- Tenacious, result and customer oriented
- Excellent communication skills, independent and highly motivated
- Working experience in wafer fab as Product Engineering, Yield Engineering, Device Engineering or Process Integration Engineering
|
|