Position Detail

Process Integration Principal Engineer
Advertised on : 25 Oct 2021 | Closing Date :24 Dec 2021


Responsibilities:

  • To manage Integration sections respectively to ramp up and stabilize new technologies/ processes and products in terms of process control modules (PCM) yield, product yield and reliability. Innovate to implement process highway (robust margin) to reduce tool/ chamber constraints.
  • To manage fab/ process change control and management.
  • Define and drive respective sections to meet section/ department BBS targets (including internal D0, PCM yield, wafer scrap reduction and Cpk improvement)
  • Interact with TSMC and NXP mother-fabs regularly on integration alignment and benchmarking.
  • Initiate and lead change throughout process integration, yield / process improvement organization that promote and encourage continuous improvement in all work areas and activities.
  • Co-work with Technology Development (TD) and mother fab to ensure successful technology transfer, electrical characterization, device modeling of active/ passive devices and readiness from PD to PI for production ramp-up. Understand and resolve all process integration issues for new technology.
  • Interface and work with Business Support team to support customers’ need.
  • Develop action plans working with operations and business support team to resolve customers’ technical issues Manage and guide group of engineers to ensure error free prototype execution, PCM improvement, and baseline yield improvement (test vehicle and products).
  • Analyze PCM yield and product yield and provide solutions for failing parameters.
  • Facilitate the creation of PCM recipes for production and engineering.
  • Responsible for WAT system management include test data uploading, analysis etc
  • Lead and manage advanced module integration for ‘next generation’ processes

Requirements:

  • PhD/Masters/Degree in Electrical/Electronics Engineering with strong semiconductor device physics background
  • At least 5 — 10 years’ technical and supervisory experience in a semiconductor manufacturing industry.
  • Strong advance CMOS/ Flash/ Non-Volatile Memory/ HV wafer fabrication knowledge
  • Good interpersonal, communication skills
  • Strong leadership and motivational abilities
  • Competent in SPC, 8D, KT problem solving and decision making
  • Proficient in PROMIS system, Klarity ACE, Statistical Analytics tool (e.g. JMP, Minitab, etc.) will  be added advantage
  • Automotive Quality Mindset and Stop & Fix Mindset
 
Categories : Engineering - Process
Type of Employment : Permanent
Minimum Experience : 5 Years
Work Location : Singapore
  

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