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Responsibilities:
- To manage and lead a group of equipment Senior Engineers, Engineer, and Associate Engineers to optimize equipment capability and utilization to meet modules goals
- Establish plans and strategies to meet and surpass manufacturing performance indices
- Set targets, goals and projects for the section to minimize wafer scrap, equipment cost per wafer and optimize equipment capability and utilization to meet operation needs
- Liaise with TSMC and NXP to discuss and compare equipment performance and reliability to improve equipment performance
- Plan, track and measure equipment capacity.
- Forecast and budget on equipment upkeep and any other related expenditures
- Establish Preventive Maintenance (PM) plans for all equipment and optimize PM for quality and cost
- Liaise with vendors to resolve equipment issues and improve equipment performance
- Manage process in equipment improvement to achieve high OEE
- Spearhead and facilitate continuous improvement through QIT programs to optimize equipment utilization and cost of maintenance
- Perform appraisals and map career path for subordinates
- Provide training and guidance to Engineers and Associate Engineers to achieve maximum performance effectiveness
- Conduct regular feedback and communication sessions with staff for work improvement and maintain morale
- Responsible for documentation
- Perform fab audit &ensure good housekeeping and safety practices in the Fab
Requirements:
- PhD/MSc/Degree in Electrical/Electronics/Mechanical/Chemical Engineering or Physics
- At least 6 – 10 years relevant experience in wafer fab with CMP experience (equipment/process)
- Good interpersonal and communication skills
- Good team player and has strong leadership qualities
- Good analytical and problem solving skills
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